South Korean electronics giant Samsung has successfully arranged 32 DDR2 DRAM 2 Gb 80 nm chips in a two-layer configuration, creating the largest memory module for servers currently available.
To build this memory module, the South Korean DRAM manufacturer reported that it utilized FB-DIMM technology, which has been widely accepted in the memory industry. This technology can process data twice as fast as the current R-DIMM and allows manufacturers to combine AMB memory chips with other memory chips.
The new Samsung circuit board is compatible with thin-form factor servers. Samsung plans to launch products ranging from 512 MB to 8 GB to establish a strong presence in the emerging FB-DIMM market right from the start.
The pricing and official launch date for the product have yet to be disclosed. Chipmaker Intel has also announced plans to release an FB-DIMM model for servers next year.
Research firm Gartner predicts that the global DRAM market for servers will reach $24.1 billion in 2006.
